Title :
Reliability evaluation and failure analysis for high voltage ceramic capacitor
Author :
Kim, Jin-Woo ; Shin, Seung-Hun ; Ryu, Dong-Su ; Chang, Seog-Weon
Author_Institution :
Quality & Reliability Lab., Daewoo Electron. Co. Ltd., Incheon, South Korea
Abstract :
This paper presents a result of failure analysis and reliability evaluation for high voltage ceramic capacitors. The failure modes and failure mechanisms were studied in two ways in order to estimate component life and failure rate. The causes of failure mechanisms for zero resistance phenomena under withstanding voltage test in high voltage ceramic capacitors molded by epoxy resin were studied by establishing an effective root cause failure analysis. Particular emphasis was placed on breakdown phenomena at the ceramic-epoxy interface. The validity of the results in this study was confirmed by the results of accelerated testing. Thermal cycling test for high voltage ceramic capacitor mounted on a magnetron were implemented. Delamination between ceramic and epoxy, which might cause electrical short in underlying circuitry, can occur during curing or thermal cycle. The results can be conveniently used to quickly identify defective lots, determine B10 life estimation for each lot at the level of inspection, and detect major changes in the vendors processes. Also, the condition for dielectric breakdown was investigated for the estimation of failure rate with load-strength interference model
Keywords :
ceramic capacitors; delamination; electric breakdown; electron device testing; failure analysis; interface structure; moulding; plastic packaging; power capacitors; reliability; thermal stresses; accelerated testing; breakdown phenomena; ceramic-epoxy delamination; ceramic-epoxy interface breakdown; component failure rate; component life; curing; defective lot identification; dielectric breakdown; electrical short; epoxy resin molded ceramic capacitors; failure analysis; failure mechanisms; failure modes; failure rate estimation; high voltage ceramic capacitor; inspection; life estimation; load-strength interference model; magnetron; reliability evaluation; root cause failure analysis; thermal cycling; thermal cycling test; withstanding voltage test; zero resistance phenomena; Capacitors; Ceramics; Circuit testing; Curing; Delamination; Electric breakdown; Epoxy resins; Failure analysis; Life estimation; Voltage;
Conference_Titel :
Electronic Materials and Packaging, 2001. EMAP 2001. Advances in
Conference_Location :
Jeju Island
Print_ISBN :
0-7803-7157-7
DOI :
10.1109/EMAP.2001.983999