Title :
Study on residual stress in viscoelastic thin film using curvature measurement method
Author :
Im, Y.T. ; Kim, J.-H. ; Choi, S.T.
Author_Institution :
Dept. of Mech. Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
Abstract :
Using LSM (laser scanning method), the radius of curvature due to thermal deformation in polyimide film coated on Si substrate is measured. Since the polyimide film shows viscoelastic behavior, i.e., the modulus and deformation of the film vary with time and temperature, we estimate the relaxation modulus and the residual stresses of the polyimide film by measuring the radius of curvature and subsequently by performing viscoelastic analysis. The residual stresses relax by an amount of 10% at 100°C and 20% at 150°C for two hours
Keywords :
curvature measurement; deformation; internal stresses; optical scanners; packaging; polymer films; thermal stresses; viscoelasticity; 100 degC; 150 degC; LSM; curvature measurement method; laser scanning method; polyimide film; relaxation modulus; residual stress; thermal deformation; viscoelastic analysis; viscoelastic behavior; viscoelastic thin film; Elasticity; Polyimides; Residual stresses; Semiconductor films; Stress measurement; Substrates; Temperature; Time measurement; Transistors; Viscosity;
Conference_Titel :
Electronic Materials and Packaging, 2001. EMAP 2001. Advances in
Conference_Location :
Jeju Island
Print_ISBN :
0-7803-7157-7
DOI :
10.1109/EMAP.2001.984007
