Study on residual stress in viscoelastic thin film using curvature measurement method

Author

Im, Y.T. ; Kim, J.-H. ; Choi, S.T.

Author_Institution

Dept. of Mech. Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea

fYear

2001

fDate

2001

Firstpage

341

Lastpage

346

Abstract

Using LSM (laser scanning method), the radius of curvature due to thermal deformation in polyimide film coated on Si substrate is measured. Since the polyimide film shows viscoelastic behavior, i.e., the modulus and deformation of the film vary with time and temperature, we estimate the relaxation modulus and the residual stresses of the polyimide film by measuring the radius of curvature and subsequently by performing viscoelastic analysis. The residual stresses relax by an amount of 10% at 100°C and 20% at 150°C for two hours

Keywords

curvature measurement; deformation; internal stresses; optical scanners; packaging; polymer films; thermal stresses; viscoelasticity; 100 degC; 150 degC; LSM; curvature measurement method; laser scanning method; polyimide film; relaxation modulus; residual stress; thermal deformation; viscoelastic analysis; viscoelastic behavior; viscoelastic thin film; Elasticity; Polyimides; Residual stresses; Semiconductor films; Stress measurement; Substrates; Temperature; Time measurement; Transistors; Viscosity;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Materials and Packaging, 2001. EMAP 2001. Advances in

Conference_Location

Jeju Island

Print_ISBN

0-7803-7157-7

Type

conf

DOI

10.1109/EMAP.2001.984007

Filename

984007