Title :
Singular stress analysis in a viscoelastic thin layer bonded to an elastic substrate using realistic relaxation function
Author_Institution :
Sch. of Mechatronics Eng., Korea Univ. of Technol. & Educ., Chungnam, South Korea
Abstract :
This paper deals with the stress singularity induced at the interface corner between the perfectly bonded thin layer and elastic substrate subjected to a uniform temperature change and a shear loading using realistic relaxation function. The thin layer is assumed to be a linear viscoelastic material. The time-domain boundary element method is used to investigate the behavior of stresses for the whole interface. Within the context of a linear viscoelastic theory, a stress singularity exists at the point where the interface between one of the elastic substrate and the viscoelastic thin layer intersects the free surface
Keywords :
boundary-elements methods; interface structure; packaging; stress analysis; stress relaxation; thermal stresses; time-domain analysis; viscoelasticity; elastic substrate; free surface; interface corner; linear viscoelastic theory; perfectly bonded thin layer; relaxation function; shear loading; singular stress analysis; stress behavior; stress singularity; thin layer linear viscoelastic material; time-domain boundary element method; uniform temperature change; viscoelastic thin layer; Bonding; Dielectric substrates; Educational technology; Elasticity; Electronic packaging thermal management; Laplace equations; Residual stresses; Temperature; Thermal stresses; Viscosity;
Conference_Titel :
Electronic Materials and Packaging, 2001. EMAP 2001. Advances in
Conference_Location :
Jeju Island
Print_ISBN :
0-7803-7157-7
DOI :
10.1109/EMAP.2001.984009