DocumentCode :
2247248
Title :
A micro variable inductor chip using MEMS relays
Author :
Zhou, Shifang ; Sun, Xi-Qing ; Carr, William N.
Author_Institution :
Microelectron. Res. Center, New Jersey Inst. of Technol., Newark, NJ, USA
Volume :
2
fYear :
1997
fDate :
16-19 Jun 1997
Firstpage :
1137
Abstract :
An adjustable inductor which is digitally controlled by microrelays has been made using combined surface and bulk micromachining technology. The microrelays were fabricated using a TaSi2/SiO 2 bimorph cantilever beam, a gold-to-gold electrical contact, aluminum as sacrificial layer, and a combined electrostatic and thermal actuation mechanism. The silicon substrate underneath the inductor region was etched out to reduce the substrate eddy current loss. Sixteen different inductance values ranging from 2.5 nH to 324.8 nH were obtained using four microrelays. The minimum self-resonant frequency is 1.9 GHz. The lowest measured thermal power and electrostatic voltage for the combined actuation of microrelays are 8.0 mW and 20 V, respectively. The measured contact resistance is typically 0.6 to 0.8 ohms
Keywords :
contact resistance; eddy currents; elemental semiconductors; inductors; microactuators; micromachining; semiconductor relays; silicon; silicon compounds; tantalum compounds; 0.6 to 0.8 ohm; 1.9 GHz; 20 V; 8.0 mW; MEMS relays; TaSi2-SiO2-Si; adjustable inductor; bimorph cantilever beam; bulk micromachining; contact resistance; electrical contact; electrostatic/thermal actuation mechanism; inductor region; micro variable inductor chip; sacrificial layer; self-resonant frequency; substrate eddy current loss; surface micromachining; Digital control; Digital relays; Electric variables control; Electrical resistance measurement; Electrostatic measurements; Inductors; Micromachining; Micromechanical devices; Microrelays; Thermal variables control;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid State Sensors and Actuators, 1997. TRANSDUCERS '97 Chicago., 1997 International Conference on
Conference_Location :
Chicago, IL
Print_ISBN :
0-7803-3829-4
Type :
conf
DOI :
10.1109/SENSOR.1997.635404
Filename :
635404
Link To Document :
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