Title :
Thermal buckling actuator for micro relays
Author :
Seki, Tomonori ; Sakata, Minoru ; Nakajima, Takuya ; Matsumoto, Mikio
Author_Institution :
Central Res. & Dev. Lab., OMRON Corp., Ibaraki, Japan
Abstract :
An actuator for micromachined relays has been investigated. The actuator is fabricated by the sealed-cavity process, a micromachining technology. It has a thin Si clamped-clamped beam which is deformed by buckling due to thermal SiO2 built-in stress and thermal stress. The actuator size is 2.5 mm(L)×0.5 mm(W)×0.02 mm(T). 25-micron deflection at the center point and 2.0 gf force were obtained with 27 V/25 mA input power
Keywords :
buckling; microactuators; micromachining; semiconductor relays; thermal stresses; 0.02 mm; 0.5 mm; 2.5 mm; 25 mA; 27 V; Si; Si clamped-clamped beam; Si-SiO2; actuator size; deflection; micromachined relays; micromachining technology; sealed-cavity process; thermal SiO2 built-in stress; thermal buckling actuator; thermal stress; Actuators; Capacitive sensors; Costs; Equations; Micromachining; Microrelays; Power system relaying; Relays; Thermal expansion; Thermal stresses;
Conference_Titel :
Solid State Sensors and Actuators, 1997. TRANSDUCERS '97 Chicago., 1997 International Conference on
Conference_Location :
Chicago, IL
Print_ISBN :
0-7803-3829-4
DOI :
10.1109/SENSOR.1997.635409
