Mechanical fatigue tests of solder joint under mixed-mode loading cases

Author

Park, Tae-Sang ; Lee, Soon-Bok

Author_Institution

Dept. of Mech. Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea

fYear

2001

fDate

2001

Firstpage

438

Lastpage

443

Abstract

To give a proper and accurate estimation of the fatigue life of solder joints, a mechanical fatigue test under mixed-mode loading cases is proposed. The loading phase is controlled by the angle of loading direction. Experiments are conducted with eutectic 63SnPb solder joints. The isothermal mechanical fatigue tests were performed under conditions of several loading phases. Constant displacement controlled tests are performed using a micro-mechanical test apparatus. Failure patterns of the fatigue tests are observed and discussed

Keywords

assembling; fatigue testing; lead alloys; micromechanical devices; printed circuit manufacture; printed circuit testing; soldering; surface mount technology; test equipment; tin alloys; SnPb; constant displacement controlled tests; eutectic SnPb solder joints; failure patterns; fatigue tests; isothermal mechanical fatigue tests; loading direction angle; loading phase; loading phases; mechanical fatigue tests; micro-mechanical test apparatus; mixed-mode loading cases; solder joint; solder joint fatigue life; Capacitive sensors; Computer aided software engineering; Electronic equipment testing; Fatigue; Micromechanical devices; Performance evaluation; Soldering; System testing; Tensile stress; Thermal expansion;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Materials and Packaging, 2001. EMAP 2001. Advances in

Conference_Location

Jeju Island

Print_ISBN

0-7803-7157-7

Type

conf

DOI

10.1109/EMAP.2001.984024

Filename

984024