Title :
Recent enhancements to the SmartBrick structural health monitoring platform
Author :
Harms, Tyler ; Bastianini, Filippo ; Sedigh, Sahra
Author_Institution :
Dept. of Electr. & Comput. Eng., Missouri Univ. of Sci. & Technol., Rolla, MO, USA
Abstract :
This paper introduces several new developments in the SmartBrick structural health monitoring platform. The system, which has been described in previous papers, provides an extremely low-power, long-term method for remote structural health monitoring. The system is capable of monitoring a diverse range of environmental and structural phenomena, including strain, vibration, tilt, and temperature; and communicating the collected data and any alerts over the GSM cellular infrastructure. The system is completely autonomous and wireless, requiring only its self-contained power and GSM network coverage to operate unattended for five or more years. The emphasis of this paper is on advances made in the third generation of the SmartBrick platform. Highlights include the development of a Web interface that facilitates retrieval and visualization of data and remote maintenance and calibration of the system, and additional enhancements made to support dynamic structural monitoring. The paper also includes a survey of recent wireless SHM systems, and a comparison of these solutions with the SmartBrick platform.
Keywords :
computerised monitoring; condition monitoring; data visualisation; structural engineering; GSM cellular infrastructure; SmartBrick structural health monitoring platform; Web interface development; data retrieval; data visualization; dynamic structural monitoring support; long term method; low power method; remote maintenance; self-contained power; strain; system calibration; temperature; vibration; wireless SHM system; Base stations; Bridges; Calibration; Capacitive sensors; Costs; GSM; Intelligent transportation systems; Portable computers; Remote monitoring; Safety;
Conference_Titel :
Intelligent Transportation Systems, 2009. ITSC '09. 12th International IEEE Conference on
Conference_Location :
St. Louis, MO
Print_ISBN :
978-1-4244-5519-5
Electronic_ISBN :
978-1-4244-5520-1
DOI :
10.1109/ITSC.2009.5309517