DocumentCode
2247526
Title
Micromechanical relay with electrostatic actuation
Author
Hillerich, B. ; Kozlowski, F. ; Evers, Christine
Volume
2
fYear
1997
fDate
16-19 Jun 1997
Firstpage
1165
Abstract
Three variants of electrostatically driven microrelays are reported. The concepts of these microrelays are a cantilever beam, a fixed-fixed beam and a torsion beam with a double contact configuration. Because of the complete fabrication by surface micromachining technology, there is no need for a chip bonding process. This paper reports on the device concept, fabrication and performance of the microrelay
Keywords
contact resistance; electrostatic devices; internal stresses; micromachining; micromechanical devices; semiconductor relays; 2 kHz; 2.6 mus; Si; SiO2-Au-SiO2; cantilever beam; contact resistance; double contact configuration; electrostatic actuation; electrostatically driven microrelays; fixed-fixed beam; mechanical switching frequency; micromechanical relay; microrelay performance; residual layer stresses; small signal applications; surface micromachining technology; switching time; torsion beam; Contacts; Electrostatic actuators; Gold; Hafnium; Micromechanical devices; Microrelays; Relays; Solid state circuits; Structural beams; Switches;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid State Sensors and Actuators, 1997. TRANSDUCERS '97 Chicago., 1997 International Conference on
Conference_Location
Chicago, IL
Print_ISBN
0-7803-3829-4
Type
conf
DOI
10.1109/SENSOR.1997.635412
Filename
635412
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