DocumentCode
2248063
Title
Measurements and simulations for ground-to-ground plane noise DDR RAM daughter cards and motherboards for EMI emissions
Author
Archambeault, Bruce ; Connor, Samuel
Author_Institution
IBM Corp., Research Triangle Park, NC, USA
Volume
1
fYear
2002
fDate
19-23 Aug. 2002
Firstpage
105
Abstract
Unintentional noise between the ground planes on a daughter card and a motherboard can be a significant source of EMI emissions from multiple board systems. This noise is not predicted from traditional signal integrity tools, nor from most EMC prediction tools unless a full wave analysis is performed. This work focused on the ground-to-ground noise between a motherboard and SDRAM and DDR RAM DIMM modules. Differential voltage measurements were made to determine the amount of noise voltage between the ground-reference of the motherboard and daughter card (DIMM) module. By analysis of the intentional current on the memory bus lines, the voltage between the ground-reference planes can be estimated with good accuracy.
Keywords
DRAM chips; SRAM chips; electric noise measurement; electromagnetic compatibility; electromagnetic interference; voltage measurement; DDR RAM daughter cards; DIMM modules; EMI emissions; SDRAM; differential voltage measurements; full wave analysis; ground-reference; ground-to-ground plane noise; memory bus lines; motherboards; noise voltage; Circuit noise; Connectors; Electromagnetic compatibility; Inductance; Noise measurement; Performance analysis; Pins; Read-write memory; Signal analysis; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility, 2002. EMC 2002. IEEE International Symposium on
Conference_Location
Minneapolis, MN, USA
Print_ISBN
0-7803-7264-6
Type
conf
DOI
10.1109/ISEMC.2002.1032456
Filename
1032456
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