• DocumentCode
    2248063
  • Title

    Measurements and simulations for ground-to-ground plane noise DDR RAM daughter cards and motherboards for EMI emissions

  • Author

    Archambeault, Bruce ; Connor, Samuel

  • Author_Institution
    IBM Corp., Research Triangle Park, NC, USA
  • Volume
    1
  • fYear
    2002
  • fDate
    19-23 Aug. 2002
  • Firstpage
    105
  • Abstract
    Unintentional noise between the ground planes on a daughter card and a motherboard can be a significant source of EMI emissions from multiple board systems. This noise is not predicted from traditional signal integrity tools, nor from most EMC prediction tools unless a full wave analysis is performed. This work focused on the ground-to-ground noise between a motherboard and SDRAM and DDR RAM DIMM modules. Differential voltage measurements were made to determine the amount of noise voltage between the ground-reference of the motherboard and daughter card (DIMM) module. By analysis of the intentional current on the memory bus lines, the voltage between the ground-reference planes can be estimated with good accuracy.
  • Keywords
    DRAM chips; SRAM chips; electric noise measurement; electromagnetic compatibility; electromagnetic interference; voltage measurement; DDR RAM daughter cards; DIMM modules; EMI emissions; SDRAM; differential voltage measurements; full wave analysis; ground-reference; ground-to-ground plane noise; memory bus lines; motherboards; noise voltage; Circuit noise; Connectors; Electromagnetic compatibility; Inductance; Noise measurement; Performance analysis; Pins; Read-write memory; Signal analysis; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 2002. EMC 2002. IEEE International Symposium on
  • Conference_Location
    Minneapolis, MN, USA
  • Print_ISBN
    0-7803-7264-6
  • Type

    conf

  • DOI
    10.1109/ISEMC.2002.1032456
  • Filename
    1032456