Characterization of thermopile based on CMOS materials and post CMOS micromachining

Recently, the micromachined sensors using CMOS compatible process are developed and attractive for mass production. The thermopile sensor manufacture by CMOS process and post-CMOS bulk micromachining was reported by H. Baltes (2000), that using back-side Si bulk etching using KOH solution. This paper presents characterization analysis of practical thermopile sensor, using the extensive experiment result of measuring heat conductance of thermopile detector produced by CMOS compatible process and post front-side Si bulk etching using TMAH solution.