DocumentCode :
2248347
Title :
EM coupling and suppression through slots into lossless overmoded cavities using the multilevel fast multipole algorithm
Author :
Siah, E.S. ; Sertel, K. ; Volakis, J.L. ; Liepa, V.
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
Volume :
1
fYear :
2002
fDate :
19-23 Aug. 2002
Firstpage :
161
Abstract :
With increased use of wireless communication devices and integrated wireless sensors, the problem of electromagnetic coupling and interference from radiating devices into electronic components or tissues cells becomes more crucial. Previous works in this area have concentrated on the use of the Finite Difference Time Domain or approximate models for EMC analysis. In this paper, we employ the multilevel fast multipole algorithm for EMC analysis on complicated platforms. To being with, we will investigate the effect of various aperture shapes on coupling into an overmoded lossless rectangular cavity. Further, the effect on EM coupling due to penetration of wire traces through apertures into the cavity interior will be investigated. Finally, a method of improving shielding via the use of a sequence of an array of wire strips and slot shadowing will be investigated and presented.
Keywords :
electromagnetic compatibility; electromagnetic coupling; electromagnetic interference; electromagnetic shielding; EM coupling; EM suppression; EMC analysis; aperture shapes; electromagnetic coupling; electromagnetic interference; finite difference time domain; integrated wireless sensors; lossless overmoded cavities; multilevel fast multipole algorithm; overmoded lossless rectangular cavity; slot shadowing; tissues cells; wire strips array; wire traces penetration; wireless communication devices; Apertures; Electromagnetic compatibility; Electromagnetic coupling; Electromagnetic interference; Electromagnetic radiative interference; Electronic components; MLFMA; Wire; Wireless communication; Wireless sensor networks;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility, 2002. EMC 2002. IEEE International Symposium on
Conference_Location :
Minneapolis, MN, USA
Print_ISBN :
0-7803-7264-6
Type :
conf
DOI :
10.1109/ISEMC.2002.1032467
Filename :
1032467
Link To Document :
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