DocumentCode :
2248367
Title :
Laser-SQUID microscopy: novel nondestructive and non-electrical-contact tool for inspection, monitoring and analysis of LSI-chip-electrical-defects
Author :
Nikawa, K.
Author_Institution :
NEC Corp., Kawasaki, Japan
fYear :
2001
fDate :
Oct. 31 2001-Nov. 2 2001
Firstpage :
62
Lastpage :
63
Abstract :
We propose a new technique that can detect electrical defects nondestructively without any electrical contact with the outside. It is, therefore, applicable not only to the failure analysis but also to the in-line inspection and monitoring. The basic idea of the technique is detection of a magnetic field produced by a laser-beam-induced current by using a HTS (high-temperature-superconducting) DC-SQUID (superconducting quantum interference device) magnetometer. The intensity of magnetic flux detected by the SQUID magnetometer is imaged, while scanning a laser beam and a sample relatively. The spatial resolution of this scanning laser-SQUID microscopy ("laser-SQUID" for short) is expected to be much better than conventional SQUID microscopy because it is limited by the laser beam diameter: that of the conventional SQUID microscopy, on the other hand, is limited by the size of the detector and the distance between the detector and a sample. An experiment using a prototype system has showed that the spatial resolution is about one um. Other experiments have demonstrated the application of the laser-SQUID to LSI inspection and analysis.
Keywords :
OBIC; SQUID magnetometers; failure analysis; inspection; integrated circuit testing; large scale integration; microscopy; monitoring; HTS DC-SQUID magnetometer; LSI chip; electrical defects; failure analysis; in-line inspection; in-line monitoring; laser-SQUID microscopy; laser-beam-induced current; magnetic field detection; nondestructive noncontact tool; spatial resolution; Condition monitoring; Contacts; Failure analysis; High temperature superconductors; Inspection; Laser beams; Magnetic fields; Microscopy; SQUID magnetometers; Spatial resolution;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microprocesses and Nanotechnology Conference, 2001 International
Conference_Location :
Shimane, Japan
Print_ISBN :
4-89114-017-8
Type :
conf
DOI :
10.1109/IMNC.2001.984069
Filename :
984069
Link To Document :
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