Straightforward method to extract electrical microwave packages models

This paper shows an, accurate-straightforward electrical small signal modeling technique for radiofrequency and microwave packaged devices, developed by us. This method called DICOMPAK can be used for ceramic packaged and low cost plastic encapsulated devices. The technique employs analytically derived expressions and it is based on analysis of the measured scattering parameters over an adequate frequency range. Very good agreement between measured and simulated scattering parameters for different ceramic and plastic packaged devices from several foundries is shown