APC in the semiconductor industry, history and near term prognosis

Author

Barna, Gabriel G.

Author_Institution

Semicond. Process & Device Center, Texas Instrum. Inc., Dallas, TX, USA

fYear

1996

fDate

12-14 Nov 1996

Firstpage

364

Lastpage

369

Abstract

This paper presents an abridged history of Advanced Process Control (APC), including both Fault Detection and Classification (FDC) and Model Based Process Control (MBPC), both within TI and in the semiconductor industry. While TI was an early leader in univariate fault detection in processing tools, other manufacturers have by now implemented such methodologies. For MBPC, the MMST program gave TI a lead, but others are now following that path. For TI and the semiconductor industry as a whole, the current thrust is to develop and implement multivariate APC methods into the manufacturing operations. This paper describes the complexity of the execution of these tasks, and lists some of the available tools that are requisite for implementing these plans

Keywords

fault diagnosis; history; integrated circuit manufacture; process control; technological forecasting; APC; MBPC; advanced process control; fault classification; fault detection; model based process control; multivariate methods; semiconductor industry; univariate fault detection; Delay effects; Electronics industry; Etching; Fault detection; History; Instruments; Manufacturing processes; Process control; Semiconductor device manufacture; Semiconductor device modeling;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Semiconductor Manufacturing Conference and Workshop, 1996. ASMC 96 Proceedings. IEEE/SEMI 1996

Conference_Location

Cambridge, MA

ISSN

1078-8743

Print_ISBN

0-7803-3371-3

Type

conf

DOI

10.1109/ASMC.1996.558084

Filename

558084