DocumentCode
2252213
Title
Finite size substrate and ground plane effects on propagation characteristics of planar interconnections
Author
Kergonou, G. ; Drissi, M.
Author_Institution
Inst. Nat. des Sci. Appliques, Rennes, France
Volume
2
fYear
2002
fDate
19-23 Aug. 2002
Firstpage
701
Abstract
The groundplane and substrate finitudes are examined on the propagation characteristics of planar interconnections using the finite element method. The observed effects, for both truncations, are quantified and explained for the microstrip, coplanar waveguide (CPW) and stripline structures.
Keywords
coplanar waveguides; electromagnetic wave propagation; interconnections; microstrip lines; printed circuits; strip lines; substrates; waveguide theory; PCB planar interconnections; coplanar waveguide; effective permittivity; electromagnetic simulations; finite element method; finite size PCB; ground plane effects; microstrip; planar interconnections; propagation characteristics; stripline structures; Capacitors; Coplanar waveguides; Dielectric losses; Dielectric substrates; Magnetic analysis; Microstrip; Permittivity; Planar waveguides; Stripline; Strips;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility, 2002. EMC 2002. IEEE International Symposium on
Conference_Location
Minneapolis, MN, USA
Print_ISBN
0-7803-7264-6
Type
conf
DOI
10.1109/ISEMC.2002.1032678
Filename
1032678
Link To Document