Title :
Material and process considerations for reliable overniolded flip chip PBGAs
Author :
Chan, Hing ; Alvarez, Sheila ; Carson, George
Author_Institution :
ST Assembly Test Services, Inc.
Keywords :
Assembly; Chip scale packaging; Costs; Delamination; Flip chip; Materials reliability; Materials testing; Packaging machines; Resins; Switches;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 2002. IEMT 2002. 27th Annual IEEE/SEMI International
Conference_Location :
San Jose, CA, USA
Print_ISBN :
0-7803-7301-4
DOI :
10.1109/IEMT.2002.1032717
