DocumentCode

2252969

Title

Material and process considerations for reliable overniolded flip chip PBGAs

Author

Chan, Hing ; Alvarez, Sheila ; Carson, George

Author_Institution

ST Assembly Test Services, Inc.

fYear

2002

fDate

17-18 July 2002

Firstpage

23

Lastpage

26

Keywords

Assembly; Chip scale packaging; Costs; Delamination; Flip chip; Materials reliability; Materials testing; Packaging machines; Resins; Switches;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 2002. IEMT 2002. 27th Annual IEEE/SEMI International

Conference_Location

San Jose, CA, USA

Print_ISBN

0-7803-7301-4

Type

conf

DOI

10.1109/IEMT.2002.1032717

Filename

1032717