DocumentCode :
2252983
Title :
Fabrication and characterization of MEMS based wafer-scale palladium-silver alloy membranes for hydrogen separation and hydrogenation/dehydrogenation reactions
Author :
Tong, H.D. ; Gielens, F.C. ; Berenschot, J.W. ; de Boer, M.J. ; Gardeniers, J.G.E. ; Nijdam, W. ; van Rijn, C.J.M. ; Elwenspoek, M.C.
Author_Institution :
MESA Res. Inst., Twente Univ., Enschede, Netherlands
fYear :
2002
fDate :
24-24 Jan. 2002
Firstpage :
268
Lastpage :
271
Abstract :
In this paper, a MEMS based wafer-scale palladium-silver alloy membrane (MWSPdAgM) is presented. This membrane has the potential to be used for hydrogen purification and other applications. A palladium-silver alloy layer (Pd-Ag) was prepared by co-sputtering. The thin Pd-Ag alloy has high hydrogen selectivity, high permeation rate as well as high mechanical and chemical stability. Typical flow rates of 0.5 mol H/sub 2//m/sup 2/.s have been measured with a minimal selectivity of 550 for H/sub 2//N/sub 2/. Anodic bonding of thick glass to silicon was used to package the membrane and create a very robust module. The membrane has high mechanical strength and can withstand pressures up to 4 bars at room temperature. The presented fabrication method allows the development of a module for industrial applications that consists of a stack with a large number of glass/membrane plates.
Keywords :
hydrogen economy; hydrogenation; membranes; micromechanical devices; palladium alloys; separation; silver alloys; sputtered coatings; 4 bar; H/sub 2/; MEMS fabrication; Pd-Ag; anodic bonding; chemical stability; co-sputtering; dehydrogenation reaction; flow rate; glass/membrane plate stack; hydrogen purification; hydrogen selectivity; hydrogen separation; hydrogenation reaction; industrial applications; mechanical stability; mechanical strength; module; package; permeation rate; wafer-scale palladium-silver alloy membrane; Biomembranes; Bonding; Chemicals; Fabrication; Fluid flow measurement; Glass; Hydrogen; Micromechanical devices; Purification; Stability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 2002. The Fifteenth IEEE International Conference on
Conference_Location :
Las Vegas, NV, USA
ISSN :
1084-6999
Print_ISBN :
0-7803-7185-2
Type :
conf
DOI :
10.1109/MEMSYS.2002.984254
Filename :
984254
Link To Document :
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