Single-chip condenser miniature microphone with a high sensitive circular corrugated diaphragm

Author

Jing Chen ; Litian Liu ; Zhijian Li ; Zhimin Tan ; Yang Xu ; Jun Ma

Author_Institution

Inst. of Microelectron., Tsinghua Univ., Beijing, China

fYear

2002

fDate

24-24 Jan. 2002

Firstpage

284

Lastpage

287

Abstract

A novel single-chip condenser miniature microphone with a circular corrugated diaphragm for residual stress releasing has been proposed, fabricated and tested. The condenser microphone consists of a rigid single-crystal backplate and a flexible circular corrugated diaphragm using induced couple plasma (ICP) etching. An electrostatic-structural coupling finite element analysis (FEA) was performed for design optimization. A sensitivity of 40 mv/Pa up to 15 KHz has been achieved under a low bias voltage of 14 V, which is among the best in the presented reports.

Keywords

diaphragms; finite element analysis; internal stresses; microphones; sputter etching; 14 V; 5 kHz; circular corrugated diaphragm; design optimization; electrostatic-structural coupling finite element analysis; induced couple plasma etching; residual stress; single-chip condenser miniature microphone; single-crystal backplate; Design optimization; Electrostatic analysis; Etching; Finite element methods; Low voltage; Microphones; Performance analysis; Plasma applications; Residual stresses; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems, 2002. The Fifteenth IEEE International Conference on

Conference_Location

Las Vegas, NV, USA

ISSN

1084-6999

Print_ISBN

0-7803-7185-2

Type

conf

DOI

10.1109/MEMSYS.2002.984258

Filename

984258