DocumentCode :
2253152
Title :
Chip scale packaging techniques for RF SAW devices
Author :
Goetz, Martin ; Jones, Chris
Author_Institution :
Clarisay, Dallas, TX, USA
fYear :
2002
fDate :
2002
Firstpage :
63
Lastpage :
66
Abstract :
Wafer-level and chip-scale packaging techniques have been developed for use with surface acoustic wave (SAW) devices. Both techniques incorporate a process for bonding a lithium tantalate RF SAW wafer to a mating wafer using adhesive. The package provides a low loss, hermetic environment for the SAW device resulting in a product size at least three times smaller than competitively packaged products. Results of reliability testing including mechanical, electrical and JEDEC moisture sensitivity level will be presented. An overview of various types of wafer-level and chip-scale packaging technologies used in the electronics industry today will be compared to the processes used to develop packaged SAW devices.
Keywords :
adhesives; chip scale packaging; moisture; reliability; seals (stoppers); surface acoustic wave devices; JEDEC moisture sensitivity; LiTaO3; RF SAW devices; adhesive; chip scale packaging techniques; electronics industry; hermetic environment; mating wafer; product size; reliability testing; Acoustic waves; Chip scale packaging; Electronics packaging; Lithium compounds; Radio frequency; Surface acoustic wave devices; Surface acoustic waves; Testing; Wafer bonding; Wafer scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Manufacturing Technology Symposium, 2002. IEMT 2002. 27th Annual IEEE/SEMI International
Print_ISBN :
0-7803-7301-4
Type :
conf
DOI :
10.1109/IEMT.2002.1032724
Filename :
1032724
Link To Document :
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