Title :
Automatic wedge bonding with ribbon wire for high frequency applications
Author :
Qin, Ivy Wei ; Reid, Paul ; Werner, Robert E. ; Doerr, David
Author_Institution :
Kulicke & Soffa
Keywords :
Bonding forces; Bonding processes; Frequency; Gallium arsenide; Microwave devices; Packaging; Skin effect; Temperature sensors; US Department of Energy; Wire;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 2002. IEMT 2002. 27th Annual IEEE/SEMI International
Conference_Location :
San Jose, CA, USA
Print_ISBN :
0-7803-7301-4
DOI :
10.1109/IEMT.2002.1032732
