Title :
Design and characterization of a high-performance wire-bond ball-grid-array package
Author :
Huang, Ching-Chao ; Secker, David ; Yang, Ling ; Feng, June ; Jain, Nirmal
Author_Institution :
Rambus Inc.
Keywords :
Costs; Couplings; Data mining; Etching; Impedance; Joining processes; Packaging; Routing; Testing; Wires;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 2002. IEMT 2002. 27th Annual IEEE/SEMI International
Conference_Location :
San Jose, CA, USA
Print_ISBN :
0-7803-7301-4
DOI :
10.1109/IEMT.2002.1032762
