DocumentCode

2253740

Title

Design and characterization of a high-performance wire-bond ball-grid-array package

Author

Huang, Ching-Chao ; Secker, David ; Yang, Ling ; Feng, June ; Jain, Nirmal

Author_Institution

Rambus Inc.

fYear

2002

fDate

17-18 July 2002

Firstpage

245

Lastpage

249

Keywords

Costs; Couplings; Data mining; Etching; Impedance; Joining processes; Packaging; Routing; Testing; Wires;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 2002. IEMT 2002. 27th Annual IEEE/SEMI International

Conference_Location

San Jose, CA, USA

Print_ISBN

0-7803-7301-4

Type

conf

DOI

10.1109/IEMT.2002.1032762

Filename

1032762