DocumentCode :
2253914
Title :
Reliability of CSP/lead free solder joints with different surface finishes and reflow profiles
Author :
Me, D. ; Geiger, David ; Arra, Minna ; Shangguan, Dongkai ; Phan, Hoang
Author_Institution :
FLEXTRONICS
fYear :
2002
fDate :
17-18 July 2002
Firstpage :
323
Lastpage :
328
Keywords :
Assembly; Chip scale packaging; Environmentally friendly manufacturing techniques; Lead; Soldering; Surface finishing; Surface-mount technology; Temperature distribution; Testing; Vehicles;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Manufacturing Technology Symposium, 2002. IEMT 2002. 27th Annual IEEE/SEMI International
Conference_Location :
San Jose, CA, USA
Print_ISBN :
0-7803-7301-4
Type :
conf
DOI :
10.1109/IEMT.2002.1032773
Filename :
1032773
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2253914
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