• DocumentCode
    2254000
  • Title

    Live demonstration: A baseband testbed for uplink mobile MIMO WiMAX communications

  • Author

    Wu, Yu-Jen ; Lin, Jung-Mao ; Yu, Hsin-Yi ; Ma, Hsi-Pin

  • Author_Institution
    Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
  • fYear
    2009
  • fDate
    24-27 May 2009
  • Firstpage
    798
  • Lastpage
    798
  • Abstract
    Recently, orthogonal frequency division multiple access (OFDMA) systems gain more and more attention because OFDMA systems provide higher data rate, better spectrum efficiency and more flexibility in managing channel bandwidth than other systems. This paper describes the implementation of a multi-input multi-output (MIMO)-OFDMA uplink baseband receiver for 802.16e standard in system-on-chip (SoC) platform. As SoC design methodology becomes commonplace and design complexity continues to increase, designers are faced with the daunting task of meeting escalating design requirements in shrinking time-to-market windows. For solving this problem, design reuse emerged as a possible approach to boost design productivity, and intellectual property (IP)-based design methodology has begun since the 1990s. The development of rapid prototyping testbeds with the SoC design methodology has given communication systems engineers the ability to implement and test their designs on real hardware in concert with the simulation stages.
  • Keywords
    MIMO communication; OFDM modulation; WiMax; computational complexity; frequency division multiple access; mobile radio; system-on-chip; IEEE 802.16 standard; OFDMA systems; baseband testbed; design complexity; design productivity; intellectual property; mobile MIMO WiMax communications; multiple-input multiple-output systems; orthogonal frequency division multiple access systems; system-on-chip platform; uplink baseband receiver; Bandwidth; Baseband; Design methodology; Frequency conversion; MIMO; Mobile communication; System testing; System-on-a-chip; Time to market; WiMAX;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems, 2009. ISCAS 2009. IEEE International Symposium on
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-3827-3
  • Electronic_ISBN
    978-1-4244-3828-0
  • Type

    conf

  • DOI
    10.1109/ISCAS.2009.5117875
  • Filename
    5117875