Solving wire bond process challenges for QFN packaging

The introduction of quad flat non-leaded frames now provides manufacturers with an ability to significantly reduce the finished size of a surface mounted component. Component manufacturers have begun to convert many designs to quad flat non-leaded (QFN) format due to the significant cost savings provided. By widening the frame strip and increasing site density, manufacturers can process a larger number of units through the production line and improve assembly efficiency. In addition, each unit occupies a smaller finished volume, reducing the amount of material and providing a cost savings per package. This paper discusses the challenges of wire bond for QFN package designs and describes how new wire bond capabilities and process optimization can improve production yields.