DocumentCode
2254265
Title
Inspection challenges of leadless packages
Author
Bertz, Robert ; Leahy, Patrick
Author_Institution
RVSI, New Berlin, WI, USA
fYear
2002
fDate
2002
Firstpage
418
Lastpage
422
Abstract
The advantages of leadless devices are many, but along with the new technology come new inspection challenges. This paper explores the post-singulation inspection challenges related to the implementation of leadless packages from the perspective of a user implementing a new packaging technology, as well as that of a supplier of inspection tools working to address unique challenges inherent in the package design. Inspection challenges to be reviewed include coplanarity, pad integrity, board quality, package sides and mark inspection.
Keywords
inspection; packaging; inspection technology; leadless package; Assembly; Costs; Inspection; Lead compounds; Manufacturing processes; Packaging machines; Performance evaluation; Semiconductor device packaging; Surface-mount technology; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Manufacturing Technology Symposium, 2002. IEMT 2002. 27th Annual IEEE/SEMI International
Print_ISBN
0-7803-7301-4
Type
conf
DOI
10.1109/IEMT.2002.1032792
Filename
1032792
Link To Document