3-D lithography and metal surface micromachining for RF and microwave MEMS

Author

Jun-Bo Yoon ; Byeong-Il Kim ; Yun-Seok Choi ; Euisik Yoon

Author_Institution

Dept. of Electr. Eng. & Comput. Sci., Korea Adv. Inst. of Sci. & Technol., Taejon, South Korea

fYear

2002

fDate

24-24 Jan. 2002

Firstpage

673

Lastpage

676

Abstract

A new metal surface micromachining technology utilizing 3-D lithography, electroplating, and mechanical polishing has been developed to fabricate arbitrary 3-D metal microstructures as post-IC processes at low temperature below 120/spl deg/C. Using this technology, various highly-suspended 3-D microstructures have been successfully demonstrated for RF and microwave MEMS applications. We have fabricated spiral inductors suspended 100 /spl mu/m over the substrate, coplanar waveguides suspended 50 /spl mu/m over the substrate, and complicated micro-coaxial lines which have 50 /spl mu/m-suspended center signal lines surrounded by ground shields of 100 /spl mu/m in height.

Keywords

coaxial cables; coplanar waveguides; electroplating; inductors; micromachining; micromechanical devices; polishing; ultraviolet lithography; 120 C; 3D lithography; 3D suspended microstructure; RF MEMS; coplanar waveguide; electroplating; ground shield; mechanical polishing; metal surface micromachining; micro-coaxial line; microwave MEMS; spiral inductor; Coplanar waveguides; Inductors; Lithography; Micromachining; Micromechanical devices; Microstructure; Microwave technology; Radio frequency; Spirals; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems, 2002. The Fifteenth IEEE International Conference on

Conference_Location

Las Vegas, NV, USA

ISSN

1084-6999

Print_ISBN

0-7803-7185-2

Type

conf

DOI

10.1109/MEMSYS.2002.984360

Filename

984360