DocumentCode
2255143
Title
Investigation of the hermeticity of BCB-sealed cavities for housing (RF-)MEMS devices
Author
Jourdain, A. ; De Moor, P. ; Pamidighantam, S. ; Tilmans, H.A.C.
Author_Institution
MCP/MEMS Group, IMEC vzw, Leuven, Belgium
fYear
2002
fDate
24-24 Jan. 2002
Firstpage
677
Lastpage
680
Abstract
This paper reports on the hermeticity testing of MEMS cavities using BCB as the sealing and bonding material. Hermeticity has been tested according to the MIL-STD-883D. Gross leak testing based on liquid fluorocarbons revealed that BCB sealed cavities are leak tight, which means that the MEMS devices are well protected during handling and back-end processing (e.g., wafer dicing). Further, it is shown that the He fine leak testing of the MIL-STD is not fully applicable to small volumes (<1000 nl), typically encountered for MEMS. The problem is that the undefined regime normally existing in the MIL-STD is largely extended for small cavity volumes. Microbolometers have been used as test vehicles to confirm this. Large (>10,000 nl) cavities are needed to cover the entire leakage spectrum.
Keywords
leak detection; micromechanical devices; packaging; polymers; seals (stoppers); BCB-sealed cavity; He; MIL-STD-883D; RF MEMS device housing; back-end processing; bonding material; hermeticity testing; leak testing; liquid fluorocarbon; microbolometer; wafer dicing; Helium; Microelectromechanical devices; Micromechanical devices; Protection; Radiofrequency microelectromechanical systems; Sealing materials; Switches; Testing; Vehicles; Wafer bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems, 2002. The Fifteenth IEEE International Conference on
Conference_Location
Las Vegas, NV, USA
ISSN
1084-6999
Print_ISBN
0-7803-7185-2
Type
conf
DOI
10.1109/MEMSYS.2002.984361
Filename
984361
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