• DocumentCode
    2255143
  • Title

    Investigation of the hermeticity of BCB-sealed cavities for housing (RF-)MEMS devices

  • Author

    Jourdain, A. ; De Moor, P. ; Pamidighantam, S. ; Tilmans, H.A.C.

  • Author_Institution
    MCP/MEMS Group, IMEC vzw, Leuven, Belgium
  • fYear
    2002
  • fDate
    24-24 Jan. 2002
  • Firstpage
    677
  • Lastpage
    680
  • Abstract
    This paper reports on the hermeticity testing of MEMS cavities using BCB as the sealing and bonding material. Hermeticity has been tested according to the MIL-STD-883D. Gross leak testing based on liquid fluorocarbons revealed that BCB sealed cavities are leak tight, which means that the MEMS devices are well protected during handling and back-end processing (e.g., wafer dicing). Further, it is shown that the He fine leak testing of the MIL-STD is not fully applicable to small volumes (<1000 nl), typically encountered for MEMS. The problem is that the undefined regime normally existing in the MIL-STD is largely extended for small cavity volumes. Microbolometers have been used as test vehicles to confirm this. Large (>10,000 nl) cavities are needed to cover the entire leakage spectrum.
  • Keywords
    leak detection; micromechanical devices; packaging; polymers; seals (stoppers); BCB-sealed cavity; He; MIL-STD-883D; RF MEMS device housing; back-end processing; bonding material; hermeticity testing; leak testing; liquid fluorocarbon; microbolometer; wafer dicing; Helium; Microelectromechanical devices; Micromechanical devices; Protection; Radiofrequency microelectromechanical systems; Sealing materials; Switches; Testing; Vehicles; Wafer bonding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2002. The Fifteenth IEEE International Conference on
  • Conference_Location
    Las Vegas, NV, USA
  • ISSN
    1084-6999
  • Print_ISBN
    0-7803-7185-2
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2002.984361
  • Filename
    984361