• DocumentCode
    2255684
  • Title

    SSMC: An on-chip source-synchronous multi-cycle interconnect scheme

  • Author

    Ghoneima, Maged ; Ismail, Yehea ; Khellah, Muhammad ; De, Vivek

  • fYear
    2010
  • fDate
    19-22 Dec. 2010
  • Firstpage
    272
  • Lastpage
    275
  • Abstract
    In this paper, a low-power source-synchronous multi-cycle interconnect scheme SSMC is proposed. This scheme is scalable and suitable for transferring data across different clock domains such as those in “many-core” SoCs and in 3D-ICs. SSMC replaces intermediate flip-flops by a source synchronous synchronization scheme. The proposed multi-cycle bus scheme also leads to significant energy savings due to eliminating the power hungry flip-flops and efficiently designing the source synchronization overhead. Moreover, eliminating intermediate flip-flops avoids the timing overhead of the setup time, the flip-flop delay and the single-cycle clock jitter. This delay slack can then be translated into further energy savings by downsizing the repeaters. The significant delay jitter due to capacitive coupling has been addressed and solutions are put forward to alleviate it. Circuit simulations in a 65nm process environment; indicate that energy savings up to 20% are achievable for a 6-cycle 9mm long 16-bit bus.
  • Keywords
    flip-flops; integrated circuit interconnections; system-on-chip; 3D IC; SSMC; capacitive coupling; circuit simulation; clock domains; energy savings; flip-flop delay; flip-flops; low-power source-synchronous multi-cycle interconnect scheme; many-core SoC; multi-cycle bus scheme; on-chip source-synchronous multi-cycle interconnect scheme; single-cycle clock jitter; source synchronization overhead; source synchronous synchronization scheme; Clocks; Delay; Flip-flops; Integrated circuit interconnections; Jitter; Radiation detectors; Synchronization;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics (ICM), 2010 International Conference on
  • Conference_Location
    Cairo
  • Print_ISBN
    978-1-61284-149-6
  • Type

    conf

  • DOI
    10.1109/ICM.2010.5696136
  • Filename
    5696136