DocumentCode
2256002
Title
Finite-element modeling of thermal performance for a novel water-cooled device used in switched mode power supply
Author
Xiaoling, Yu ; Quanke, Feng ; Guibin, Jiang
Author_Institution
Xi´´an Jiaotong Univ., China
Volume
2
fYear
2004
fDate
14-16 Aug. 2004
Firstpage
968
Abstract
This paper describes a novel water-cooled device used to cool secondary coils of a group of transformers in a switched mode power supply used for electroplating. The device includes a vertically bended copper board, with which a U type tube is welded. This simple device mounted on each coil tap can remove heat from three heat sources including the secondary coil, a diode under the coil tap, and two electrical resistors connected to the diode. A 3-D finite-element modeling of thermal performance of the device is presented to simulate temperature distribution of the three heat sources when they work steadily. The corresponding experimental results coincide with the simulation results, which reveal that this device can satisfy cooling requirements of the three heat sources. It has advantages of simple structure, high heat rejection efficiency and low cost.
Keywords
coils; electroplating; finite element analysis; power transformers; switched mode power supplies; temperature distribution; bended copper board; coil tap; cool secondary coil; electrical resistor; electroplating; finite-element modeling; switched mode power supply; temperature distribution; thermal performance; transformer; water-cooled device;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Electronics and Motion Control Conference, 2004. IPEMC 2004. The 4th International
Conference_Location
Xi´an
Print_ISBN
7-5605-1869-9
Type
conf
Filename
1375854
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