• DocumentCode
    2256334
  • Title

    ECP integration into the supply chain: an IBM perspective

  • Author

    Gabriel, John ; Jacques, Mary ; Kirby, J. Ray ; Mann, T. ; Pitts, Dewey

  • Author_Institution
    IBM Corp., Research Triangle Park, NC, USA
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    225
  • Lastpage
    229
  • Abstract
    IBM´s environmentally conscious products (ECP) program was established in 1991 as a proactive and strategic approach to worldwide environmental management of products for the corporation. The ECP program includes IBM´s design for environment (DFE) initiatives, through which IBM designs products to address different environmental attributes. An increasing number of products, parts, and higher level assemblies are being procured from external suppliers, thus the need to extend IBM´s ECP activities into the supply chain has become apparent. The growth of outsourcing activities, coupled with increasing requests for product information from customers related to the identification of specific product DFE attributes, material contents, and end-of-life recycling considerations, further increases the need for effective communications and efficient exchange of environmental information. This paper discusses the progress and challenges associated with IBM´s efforts in integrating ECP and DFE requirements into the supply chain
  • Keywords
    design for environment; outsourcing; recycling; ECP integration; IBM perspective; design for environment initiatives; end-of-life recycling considerations; environmental information exchange; environmentally conscious products program; material contents; outsourcing activities; procurement; product information; products design; supply chain; worldwide environmental products management; Assembly; Communication standards; Manufacturing; Planning; Product design; Product development; Protection; Recycling; Standards development; Supply chains;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics and the Environment, 2000. ISEE 2000. Proceedings of the 2000 IEEE International Symposium on
  • Conference_Location
    San Francisco, CA
  • ISSN
    1095-2020
  • Print_ISBN
    0-7803-5962-3
  • Type

    conf

  • DOI
    10.1109/ISEE.2000.857653
  • Filename
    857653