Localized statistical 3D thermal analysis considering Electro-Thermal coupling

In this paper, we propose a novel method for analyzing fewer hot spots in a chip. The method, called SNSOR (single-node successive over relaxation), is based on a novel localized relaxed iterative approach to perform statistical analysis on one hot spot at a time. Based on SNSOR, we propose an approximation method, called ET-SNSOR (electro-thermal SNSOR), to deal with the electro-thermal coupling (ETC) effects. ET-SNSOR first uses the iterative method to update correlations from ETC, and then computes standard temperature deviations for hot spots, according to ETC and updated correlations. Experiments show that ET-SNSOR is three orders of magnitude faster than the Monte-Carlo method with small errors (less than 4.76% on maximum). It only takes an average of 0.18 second to analyze one hot spot statistically for a large test case of 1.3 M nodes with ETC effects.