Title :
Creating 3D specific systems: Architecture, design and CAD
Author :
Franzon, Paul D. ; Davis, W. Rhett ; Thorolffson, Thor
Author_Institution :
Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
Abstract :
3D stacking and integration can provide system advantages. Following a brief technology review, this abstract explores application drivers, design and CAD for 3D ICs. The main application area explored in detail is that of logic on memory. This application is explored in a specific DSP example. Finally critical areas that need better solutions are explored. These include design planning, test management, and thermal management.
Keywords :
CAD; digital signal processing chips; integrated circuit design; integrated memory circuits; logic circuits; logic design; stacking; three-dimensional integrated circuits; 3D IC; 3D stacking; CAD; DSP; creating 3D specific systems; design planning; logic; memory; test management; thermal management; Application software; Design automation; Dielectric substrates; Digital signal processing; Logic; Silicon; Stacking; Testing; Thermal management; Through-silicon vias; 3D IC; 3DIC; TSV; memory on logic; stacked memor; three dimensional IC;
Conference_Titel :
Design, Automation & Test in Europe Conference & Exhibition (DATE), 2010
Conference_Location :
Dresden
Print_ISBN :
978-1-4244-7054-9
DOI :
10.1109/DATE.2010.5457086
