Title :
Resource constrained VLSI architecture for implantable neural data compression systems
Author :
Kamboh, Awais M. ; Oweiss, Karim G. ; Mason, Andrew J.
Author_Institution :
Dept. of Electr. & Comput. Eng., Michigan State Univ., East Lansing, MI, USA
Abstract :
Neural recordings from high-density microelectrode arrays implanted in the cortex require time-frequency domain processing to alleviate the data telemetry bottlenecks of bandwidth and power. Our previous work has shown that the energy compaction capability of the discrete wavelet transform (DWT) offers a practical data compression solution that faithfully preserves the information in the neural signals. This paper presents a complete compression system including both lossy and lossless compression schemes, namely the DWT and run length encoding. Performance tradeoffs and key design decisions for implantable applications are analyzed. A 32-channel, 4-level version of the circuit is presented. Custom designed in 0.5 mum CMOS, occupying only 5.75 mm2 and consuming 3mW of power (95 muW per channel at 25Ks/sec), the implantable compression circuit is well suited for intra-cortical neural interface applications.
Keywords :
CMOS integrated circuits; VLSI; data compression; discrete wavelet transforms; microelectrodes; neurophysiology; patient diagnosis; runlength codes; time-frequency analysis; CMOS; DWT; data telemetry bottlenecks; discrete wavelet transform; high-density microelectrode arrays; implantable neural data compression systems; intra-cortical neural interface applications; lossless compression schemes; neural recordings; power 3 mW; resource constrained VLSI architecture; run length encoding; size 0.5 mum; time-frequency domain processing; Bandwidth; Circuits; Compaction; Data compression; Discrete wavelet transforms; Microelectrodes; Performance analysis; Telemetry; Time frequency analysis; Very large scale integration;
Conference_Titel :
Circuits and Systems, 2009. ISCAS 2009. IEEE International Symposium on
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-3827-3
Electronic_ISBN :
978-1-4244-3828-0
DOI :
10.1109/ISCAS.2009.5118047