DocumentCode :
2258121
Title :
Mechanical properties of MEMS materials
Author :
Sharpe, W.N., Jr.
Author_Institution :
Dept. of Mech. Eng., Johns Hopkins Univ., Baltimore, MD, USA
fYear :
2001
fDate :
2001
Firstpage :
416
Lastpage :
417
Abstract :
MEMS use materials such as polysilicon, which have been extensively characterized as to their electrical properties but not for their mechanical properties. The properties of aluminum are of course well known, but not for freestanding thin films. In a very real sense, the materials used in MEMS are new materials and require novel test methods. One cannot simply cut out a specimen and place it in a test machine; one must design the specimen to be attached to the substrate at some point yet free to deform. Measuring the small forces and displacements is a challenge, and it is particularly difficult to measure strain at the micro scale
Keywords :
bending; micromechanical devices; tensile testing; Al; MEMS materials; Si; bending tests; freestanding thin films; mechanical properties; polysilicon; tensile testing; Aluminum; Displacement measurement; Force measurement; Materials testing; Mechanical factors; Micromechanical devices; Particle measurements; Resonance; Strain measurement; Tensile stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Device Research Symposium, 2001 International
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-7432-0
Type :
conf
DOI :
10.1109/ISDRS.2001.984532
Filename :
984532
Link To Document :
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