DocumentCode
2258121
Title
Mechanical properties of MEMS materials
Author
Sharpe, W.N., Jr.
Author_Institution
Dept. of Mech. Eng., Johns Hopkins Univ., Baltimore, MD, USA
fYear
2001
fDate
2001
Firstpage
416
Lastpage
417
Abstract
MEMS use materials such as polysilicon, which have been extensively characterized as to their electrical properties but not for their mechanical properties. The properties of aluminum are of course well known, but not for freestanding thin films. In a very real sense, the materials used in MEMS are new materials and require novel test methods. One cannot simply cut out a specimen and place it in a test machine; one must design the specimen to be attached to the substrate at some point yet free to deform. Measuring the small forces and displacements is a challenge, and it is particularly difficult to measure strain at the micro scale
Keywords
bending; micromechanical devices; tensile testing; Al; MEMS materials; Si; bending tests; freestanding thin films; mechanical properties; polysilicon; tensile testing; Aluminum; Displacement measurement; Force measurement; Materials testing; Mechanical factors; Micromechanical devices; Particle measurements; Resonance; Strain measurement; Tensile stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Device Research Symposium, 2001 International
Conference_Location
Washington, DC
Print_ISBN
0-7803-7432-0
Type
conf
DOI
10.1109/ISDRS.2001.984532
Filename
984532
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