• DocumentCode
    2258121
  • Title

    Mechanical properties of MEMS materials

  • Author

    Sharpe, W.N., Jr.

  • Author_Institution
    Dept. of Mech. Eng., Johns Hopkins Univ., Baltimore, MD, USA
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    416
  • Lastpage
    417
  • Abstract
    MEMS use materials such as polysilicon, which have been extensively characterized as to their electrical properties but not for their mechanical properties. The properties of aluminum are of course well known, but not for freestanding thin films. In a very real sense, the materials used in MEMS are new materials and require novel test methods. One cannot simply cut out a specimen and place it in a test machine; one must design the specimen to be attached to the substrate at some point yet free to deform. Measuring the small forces and displacements is a challenge, and it is particularly difficult to measure strain at the micro scale
  • Keywords
    bending; micromechanical devices; tensile testing; Al; MEMS materials; Si; bending tests; freestanding thin films; mechanical properties; polysilicon; tensile testing; Aluminum; Displacement measurement; Force measurement; Materials testing; Mechanical factors; Micromechanical devices; Particle measurements; Resonance; Strain measurement; Tensile stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Device Research Symposium, 2001 International
  • Conference_Location
    Washington, DC
  • Print_ISBN
    0-7803-7432-0
  • Type

    conf

  • DOI
    10.1109/ISDRS.2001.984532
  • Filename
    984532