• DocumentCode
    2258394
  • Title

    Orthogonalized linear discriminant analysis based on modified generalized singular value decomposition

  • Author

    Wu, Wei ; Ahmad, M. Omair

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Concordia Univ., Montreal, QC, Canada
  • fYear
    2009
  • fDate
    24-27 May 2009
  • Firstpage
    1629
  • Lastpage
    1632
  • Abstract
    Generalized singular value decomposition (GSVD) has been used in the literature for linear discriminant analysis (LDA) to solve the small sample size problem in pattern recognition. However, this algorithm suffers from excessive computational load when the sample dimension is high. In this paper, we present a modified version of the LDA/GSVD algorithm to enhance the computational efficiency, referred to as EGSVD-LDA algorithm, which uses the linear combination of the sample vectors to represent the singular vectors so as to circumvent the calculation of the high dimensional singular vectors through SVD. Further, to overcome the over-fitting problem of the GSVD-based algorithms, we have also proposed a new method to orthogonalize the discriminative subspace derived from the GSVD framework through a Gram-Schmidt process in an inner product space. These methods are efficient when data are high dimensional. Simulation results show that the EGSVD-LDA algorithm, especially its orthogonalized version, overcomes the computational complexity problem and provides high recognition accuracy with low computational load.
  • Keywords
    pattern recognition; singular value decomposition; Gram-Schmidt process; complexity problem; generalized singular value decomposition; orthogonalized linear discriminant analysis; pattern recognition; sample size problem; Clustering algorithms; Computational complexity; Computational efficiency; Computational modeling; Linear discriminant analysis; Matrix decomposition; Pattern recognition; Scattering; Singular value decomposition; Vectors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems, 2009. ISCAS 2009. IEEE International Symposium on
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-3827-3
  • Electronic_ISBN
    978-1-4244-3828-0
  • Type

    conf

  • DOI
    10.1109/ISCAS.2009.5118084
  • Filename
    5118084