Title :
Introduction of the automotive application of TSV device
Author :
Kamada, Tomonari
Author_Institution :
Assoc. of Super-Adv. Electron. Technol. (ASET), Tokyo, Japan
Abstract :
We introduce the automotive application of 3D integration of a semiconductor and TSV technology in this paper. We chose the stereo camera of the driving support system as the application of this trial production, because it has strong requirement about the size, the performance and the reliability from the market, and also it is sensitive device but easy to find the error.
Keywords :
automotive electronics; three-dimensional integrated circuits; 3D integration; TSV device; automotive application; trial production;
Conference_Titel :
CPMT Symposium Japan, 2012 2nd IEEE
Conference_Location :
Kyoto
Print_ISBN :
978-1-4673-2654-4
DOI :
10.1109/ICSJ.2012.6523457
