• DocumentCode
    2259177
  • Title

    SOI wafer polishing with magnetorheological finishing (MRF)

  • Author

    Tricard, Marc ; Dumas, Paul R. ; Golini, Don ; Mooney, James T.

  • Author_Institution
    QED Technol., Rochester, NY, USA
  • fYear
    2003
  • fDate
    29 Sept.-2 Oct. 2003
  • Firstpage
    127
  • Lastpage
    129
  • Abstract
    In this paper, SOI wafer polishing with magnetorheological finishing (MRF) process were discussed. A precision polishing method called magnetorheological finishing used to improve nominal thickness and associated thickness uniformity of the silicon layer.
  • Keywords
    electrolytic polishing; elemental semiconductors; magnetorheology; silicon-on-insulator; SOI wafer polishing; Si-SiO2; magnetorheological finishing; precision polishing; silicon layer; Silicon on insulator technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOI Conference, 2003. IEEE International
  • ISSN
    1078-621X
  • Print_ISBN
    0-7803-7815-6
  • Type

    conf

  • DOI
    10.1109/SOI.2003.1242924
  • Filename
    1242924
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2259177