• DocumentCode
    2259218
  • Title

    NBTI modeling in the framework of temperature variation

  • Author

    Seyab ; Hamdioui, Said

  • Author_Institution
    Comput. Eng. Lab., Delft Univ. of Technol., Delft, Netherlands
  • fYear
    2010
  • fDate
    8-12 March 2010
  • Firstpage
    283
  • Lastpage
    286
  • Abstract
    Negative Bias Temperature Instability (NBTI) has become an important reliability concern for nano-scaled Complementary Metal Oxide Semiconductor (CMOS) devices. In this paper, we present an analysis of temperature impact on various sub-processes that contribute to NBTI degradation. We demonstrate our analysis on 90nm industrial design operating in temperature range 25-125?? C. The key temperature impacts observed in our simulation are: (a) the threshold voltage increase in P-type Metal Oxide Semiconductor (PMOS) due to NBTI is very sensitive to temperature, and increases by 34% due to the temperature increment, (b) the hole mobility in PMOS inversion layer reduces by 11% with the temperature increment, and (c) the temperature has a marginal impact on the transistor delay, that increases by 3% with the temperature increment.
  • Keywords
    CMOS integrated circuits; delays; hole mobility; integrated circuit modelling; integrated circuit reliability; nanotechnology; thermal stability; CMOS; NBTI modeling; hole mobility; industrial design; nanoscaled complementary metal oxide semiconductor device; negative bias temperature instability; size 90 nm; temperature 25 C to 125 C; temperature variation; threshold voltage; transistor delay; Degradation; Metals industry; Nanoscale devices; Negative bias temperature instability; Niobium compounds; Semiconductor device modeling; Semiconductor device reliability; Temperature distribution; Temperature sensors; Titanium compounds;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Automation & Test in Europe Conference & Exhibition (DATE), 2010
  • Conference_Location
    Dresden
  • ISSN
    1530-1591
  • Print_ISBN
    978-1-4244-7054-9
  • Type

    conf

  • DOI
    10.1109/DATE.2010.5457196
  • Filename
    5457196