• DocumentCode
    2259279
  • Title

    Breakdown characteristics of PCB paralleled traces injected by rectangular pulse

  • Author

    Guodong Meng ; Yonghong Cheng ; Jianrui Song ; Ying Liu ; Kai Wu ; Jiongbiao Dong

  • Author_Institution
    State Key Lab. of Electr. Insulation & Power Equip., Xi´an Jiaotong Univ., Xi´an, China
  • fYear
    2011
  • fDate
    6-10 Sept. 2011
  • Firstpage
    144
  • Lastpage
    147
  • Abstract
    In the paper the breakdown characteristics of Printed Circuit Board (PCB) paralleled traces is investigated. Rectangular pulse with single pulse mode and repetition frequency pulse mode is injected directly to paralleled traces structure on PCB. To obtain desired pulse waveforms, a pulsed power generator is designed and set up which can output rectangular pulses with different pulse widths, pulse repetition frequency (PRF) and amplitudes. Experimental results show that the breakdown behavior between paralleled traces can be considered as “solid-gas” composite dielectric breakdown, and the breakdown characteristics are related to spacing of paralleled traces, pulse width, PRF and pulse duration, etc. Generally the breakdown voltage (Ubd) rises as trace spacing or pulse width increases and decreases as PRF or pulse duration increases. Overall, the research of susceptibility of PCB trace with conducted pulse injection could provide certain suggestions for PCB EMC design.
  • Keywords
    electric breakdown; electromagnetic compatibility; printed circuits; pulse generators; PCB EMC design; PCB paralleled trace; PCB trace susceptibility; breakdown characteristics; printed circuit board; pulse injection; pulse waveform; pulsed power generator; rectangular pulse; solid-gas composite dielectric breakdown; Dielectric breakdown; Electric fields; Electromagnetic compatibility; Generators; Surface morphology; Time-frequency analysis; PCB; PRF; breakdown; pulse width; rectangular pulse; susceptibility; trace spacing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulating Materials (ISEIM), Proceedings of 2011 International Conference on
  • Conference_Location
    Kyoto
  • Print_ISBN
    978-4-88686-074-3
  • Type

    conf

  • DOI
    10.1109/ISEIM.2011.6826370
  • Filename
    6826370