DocumentCode :
2259279
Title :
Breakdown characteristics of PCB paralleled traces injected by rectangular pulse
Author :
Guodong Meng ; Yonghong Cheng ; Jianrui Song ; Ying Liu ; Kai Wu ; Jiongbiao Dong
Author_Institution :
State Key Lab. of Electr. Insulation & Power Equip., Xi´an Jiaotong Univ., Xi´an, China
fYear :
2011
fDate :
6-10 Sept. 2011
Firstpage :
144
Lastpage :
147
Abstract :
In the paper the breakdown characteristics of Printed Circuit Board (PCB) paralleled traces is investigated. Rectangular pulse with single pulse mode and repetition frequency pulse mode is injected directly to paralleled traces structure on PCB. To obtain desired pulse waveforms, a pulsed power generator is designed and set up which can output rectangular pulses with different pulse widths, pulse repetition frequency (PRF) and amplitudes. Experimental results show that the breakdown behavior between paralleled traces can be considered as “solid-gas” composite dielectric breakdown, and the breakdown characteristics are related to spacing of paralleled traces, pulse width, PRF and pulse duration, etc. Generally the breakdown voltage (Ubd) rises as trace spacing or pulse width increases and decreases as PRF or pulse duration increases. Overall, the research of susceptibility of PCB trace with conducted pulse injection could provide certain suggestions for PCB EMC design.
Keywords :
electric breakdown; electromagnetic compatibility; printed circuits; pulse generators; PCB EMC design; PCB paralleled trace; PCB trace susceptibility; breakdown characteristics; printed circuit board; pulse injection; pulse waveform; pulsed power generator; rectangular pulse; solid-gas composite dielectric breakdown; Dielectric breakdown; Electric fields; Electromagnetic compatibility; Generators; Surface morphology; Time-frequency analysis; PCB; PRF; breakdown; pulse width; rectangular pulse; susceptibility; trace spacing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulating Materials (ISEIM), Proceedings of 2011 International Conference on
Conference_Location :
Kyoto
Print_ISBN :
978-4-88686-074-3
Type :
conf
DOI :
10.1109/ISEIM.2011.6826370
Filename :
6826370
Link To Document :
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