Criteria for approximating a layer in three-dimensional thermal models of multilayer microelectronics

This paper seeks to determine instances when three-dimensional thermal model can be simplified, yielding lower processing times but still obtain accurate results. Specifically, heat transfer in multilayer microelectronics is examined, with heat loss both to a heat sink and to the surroundings. The effect of removing a layer in the model is studied, documenting the relationship between layer thickness and conductivity and the error introduced by removing the layer