Title :
Criteria for approximating a layer in three-dimensional thermal models of multilayer microelectronics
Author :
Creel, K.E. ; Nelson, D.J.
Author_Institution :
Dept. of Mech. Eng., Virginia Tech., Blacksburg, VA, USA
Abstract :
This paper seeks to determine instances when three-dimensional thermal model can be simplified, yielding lower processing times but still obtain accurate results. Specifically, heat transfer in multilayer microelectronics is examined, with heat loss both to a heat sink and to the surroundings. The effect of removing a layer in the model is studied, documenting the relationship between layer thickness and conductivity and the error introduced by removing the layer
Keywords :
heat losses; heat sinks; heat transfer; integrated circuit technology; conductivity; error; heat loss; heat sink; heat transfer; layer thickness; multilayer microelectronics; processing times; three-dimensional thermal models; Conductivity; Electronic packaging thermal management; Heat sinks; Heat transfer; Microelectronics; Nonhomogeneous media; Rapid thermal processing; Resistance heating; Thermal engineering; Thermal management of electronics;
Conference_Titel :
Thermal Phenomena in Electronic Systems, 1994. I-THERM IV. Concurrent Engineering and Thermal Phenomena., InterSociety Conference on
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-1372-0
DOI :
10.1109/ITHERM.1994.342895
