• DocumentCode
    2259704
  • Title

    Entrance analysis of turbulent flow in an array of heated rectangular blocks

  • Author

    Faghri, M. ; Molki, M. ; Chrupcala, J. ; Asako, Y.

  • Author_Institution
    Dept. of Mech. Eng. & Appl. Mech., Rhode Island Univ., Kingston, RI, USA
  • fYear
    1994
  • fDate
    4-7 May 1994
  • Firstpage
    198
  • Lastpage
    206
  • Abstract
    A numerical study is conducted to investigate the entrance behavior of turbulent flow over arrays of rectangular heated blocks. The problem formulation is three dimensional and the solution domain includes both the developing and fully-developed regions of the array. The blocks are deployed along the lower wall of a parallel-plate duct in an attempt to simulate the cooling passages of electronic equipment. The standard k-ε turbulence model was applied to the developing region of the flow at high Reynolds numbers, while a modified Lam-Bremhorst turbulence model was considered at low-Reynolds numbers. The computations are performed for two conventional thermal boundary conditions, namely constant heat flux and constant wall temperature. Reynolds numbers ranged from 102 to 105, with Prandtl number being equal to 0.7. The array geometry was identified with H/L=1/8, S/L=1/8, B/L=1/2 and the entrance length, I/L=1/2, 2 and 6. To evaluate the accuracy of the turbulence models, numerical solutions were compared with experiment
  • Keywords
    cooling; flow; turbulence; Lam-Bremhorst turbulence model; Prandtl number; Reynolds number; array; cooling passages; developing flow; electronic equipment; entrance analysis; heated rectangular blocks; k-ε turbulence model; parallel-plate duct; thermal boundary conditions; three dimensional model; turbulent flow; Ducts; Electronics cooling; Heat engines; Heat transfer; Mechanical engineering; Temperature dependence; Thermal conductivity; Thermal factors; Thermal stresses; Viscosity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal Phenomena in Electronic Systems, 1994. I-THERM IV. Concurrent Engineering and Thermal Phenomena., InterSociety Conference on
  • Conference_Location
    Washington, DC
  • Print_ISBN
    0-7803-1372-0
  • Type

    conf

  • DOI
    10.1109/ITHERM.1994.342896
  • Filename
    342896