Enhancement of two-phase thermosyphon for cooling high heat flux power devices

Author

Kuwahara, Heikichi ; Takahashi, Kenji ; Nakajima, Tadakatsu ; Suzuki, Osamu ; Takasaki, Toshio

Author_Institution

Mech. Eng. Res. Lab., Hitachi Ltd., Ibaraki, Japan

fYear

1994

fDate

4-7 May 1994

Firstpage

184

Lastpage

189

Abstract

The purpose of this study is the enhancement of cooling of high heat flux power devices such as a thyristor by a thermosyphon system. The thermosyphon used boiling and condensation of inert dielectric fluorocarbon (FC-72). Boiling occurred from a multiple chimney heat transfer structure. A boiling chamber is connected to the condenser by a double tube, with the inner tube carrying the condensed liquid and the outer annulus carrying vapor. Using the experimental model of a thermosyphon, heat flux capacity was enhanced by increasing the flow tube height Ho, boiling chamber height H_h, and condenser liquid level H_l. High heat flux capacity was achieved with H ₀>8 cm, H_h>10 cm, and H_l>H₀, using chimney heat transfer structure with a channel width of 3 mm. The thermosyphon system was able to cool a maximum heat flux of 3 kW per device

Keywords

cooling; power electronics; thyristors; 3 kW; FC-72; boiling chamber; condensation; cooling; double tube; high heat flux power devices; inert dielectric fluorocarbon; multiple chimney heat transfer structure; thyristor; two-phase thermosyphon; Cooling; Dielectrics; Heat engines; Heat sinks; Heat transfer; Mechanical engineering; Particle separators; Refrigerants; Space heating; Thyristors;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal Phenomena in Electronic Systems, 1994. I-THERM IV. Concurrent Engineering and Thermal Phenomena., InterSociety Conference on

Conference_Location

Washington, DC

Print_ISBN

0-7803-1372-0

Type

conf

DOI

10.1109/ITHERM.1994.342898

Filename

342898