Modelling of thermal vias in thin film multichip modules

Author

Christiaens, Filip ; Beyne, Eric ; Berghmans, Jan

Author_Institution

IMEC, Heverlee, Belgium

fYear

1994

fDate

4-7 May 1994

Firstpage

101

Lastpage

107

Abstract

A semi-analytical model is presented for evaluating the thermal resistance of via networks used in thin film multichip modules. Correlations between dimensionless groups were derived from numerical data. Therefore, the via network was divided in three basic elements. This allows one to reconstruct the network as a series and parallel connection. The results of this semi-analytical model are compared with those of an existing analytical model and a 3D finite element model. Good agreement between the three models was obtained. The heat conduction efficiency of a staggered thermal via network is defined and the influence of several parameters was investigated

Keywords

modelling; multichip modules; thermal analysis; thermal resistance; thin film circuits; MCM; heat conduction efficiency; modelling; semi-analytical model; staggered thermal via network; thermal resistance; thermal vias; thin film multichip modules; via networks; Analytical models; Conductive films; Dielectric thin films; Electric resistance; Finite element methods; Multichip modules; Resistance heating; Thermal conductivity; Thermal resistance; Transistors;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal Phenomena in Electronic Systems, 1994. I-THERM IV. Concurrent Engineering and Thermal Phenomena., InterSociety Conference on

Conference_Location

Washington, DC

Print_ISBN

0-7803-1372-0

Type

conf

DOI

10.1109/ITHERM.1994.342909

Filename

342909