DocumentCode
2261883
Title
Comparison of DC measurement methods to determine GaN HEMT reliability
Author
Pazirandeh, R. ; Würfl, J. ; Tränkle, G.
Author_Institution
Ferdinand-Braun-Inst. fur Hochstfrequenztechnik, Berlin, Germany
fYear
2009
fDate
11-11 Oct. 2009
Firstpage
41
Lastpage
51
Abstract
In this paper we compare methods to determine the life-time of AlGaN/GaN HEMTs by accelerated DC life-tests. They all base on monitoring of both, IDSS and IDQ during the life-test, either at room temperature of at the elevated ambient temperature. The goal is to investigate whether interruptions of the life test to measure IDSS at room temperature can be prevented and replaced by screening this parameter during the life test at higher temperature. The investigation shows that the so called intrinsic IDSS measurement is a quite interesting and helpful tool, but too often measurement of this parameter adds additional stress to the device. In addition we saw that intermediate measurements did not stress the devices as suspected. We also observed that for stress tests at constant PDiss the drift of the gate voltage can be used as failure criterion, although it has no linear relationship to IDSS and therefore the gate voltage drifts more than IDSS and leads to more conservative life-time.
Keywords
III-V semiconductors; aluminium compounds; gallium compounds; high electron mobility transistors; life testing; semiconductor device reliability; semiconductor device testing; wide band gap semiconductors; AlGaN-GaN; DC life-test; DC measurement; HEMT reliability; gate voltage drift; room temperature; stress test; temperature 293 K to 298 K; Acceleration; Aluminum gallium nitride; Decision support systems; Gallium nitride; HEMTs; Life testing; Monitoring; Stress measurement; Temperature; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability of Compound Semiconductors Digest (ROCS), 2009
Conference_Location
Greensboro, NC
Print_ISBN
978-0-7908-0124-7
Type
conf
Filename
5313983
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