• DocumentCode
    2262026
  • Title

    Understanding loading effects of RC uniform interconnects

  • Author

    Alioto, Massimo

  • Author_Institution
    Dept. of Inf. Eng., Univ. of Siena, Siena, Italy
  • fYear
    2009
  • fDate
    24-27 May 2009
  • Firstpage
    2269
  • Lastpage
    2272
  • Abstract
    In this paper, loading effects associated with uniform RC interconnects are analytically modeled to deeply understand the effects that contribute to their input admittance. A simple reduced-order model is developed and shown to be accurate by means of simulations on a 65-nm CMOS technology. The resulting analytical expression of the model permits a deeper understanding of the loading effects of RC uniform wires on the driving circuit (e.g., the previous repeater). The model is also simple enough to be used in fast and accurate estimations in automated CAD tools. Interestingly, analysis allows for identifying a new circuit effect, the so-called ldquocapacitive shieldingrdquo effect. This effect consists in the reduction of the effective resistance (and capacitance) that is seen at the input of the interconnect, due to the wire and load capacitances. Interestingly, the capacitive effect is shown to be the dual of the well-known ldquoresistive shieldingrdquo effect associated with RC interconnects, which determines a reduction in the effective capacitance due to the wire resistance.
  • Keywords
    CMOS integrated circuits; capacitance; electric admittance; electric resistance; integrated circuit design; integrated circuit interconnections; CAD tool; CMOS technology; RC uniform interconnects; capacitive shielding effect; driving circuit; input admittance; loading effect; reduced order model; resistive shielding effect; size 65 nm; Admittance; CMOS technology; Capacitance; Energy consumption; Impedance; Integrated circuit interconnections; Repeaters; Semiconductor device modeling; Timing; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems, 2009. ISCAS 2009. IEEE International Symposium on
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-3827-3
  • Electronic_ISBN
    978-1-4244-3828-0
  • Type

    conf

  • DOI
    10.1109/ISCAS.2009.5118251
  • Filename
    5118251