DocumentCode
2262061
Title
Shielding methodologies in the presence of power/ground noise
Author
Köse, Selçuk ; Salman, Emre ; Friedman, Eby G.
Author_Institution
Dept. of Electr. & Comput. Eng., Univ. of Rochester, Rochester, NY, USA
fYear
2009
fDate
24-27 May 2009
Firstpage
2277
Lastpage
2280
Abstract
Design guidelines for shielding in the presence of power/ground (P/G) noise are presented in this paper. The effect of noise in the P/G network is analyzed for various line lengths, line widths, and interconnect driver resistances. A 2pi RLC model is used to investigate the effect of both coupling capacitance and mutual inductance on the crosstalk noise. For a range of shield lengths and widths, a shield line can degrade signal integrity by increasing the crosstalk noise on the victim line. Different physical spacing and shield insertion methods are compared for various parameters in terms of the coupling noise on the victim line for a 65 nm technology node.
Keywords
crosstalk; coupling capacitance; coupling noise; crosstalk noise; driver resistances; mutual inductance; power/ground noise; shield insertion method; shielding methodology; signal integrity; size 65 nm; Circuit noise; Coupling circuits; Crosstalk; Integrated circuit interconnections; Integrated circuit noise; Integrated circuit technology; Semiconductor device noise; Switches; Voltage; Working environment noise;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems, 2009. ISCAS 2009. IEEE International Symposium on
Conference_Location
Taipei
Print_ISBN
978-1-4244-3827-3
Electronic_ISBN
978-1-4244-3828-0
Type
conf
DOI
10.1109/ISCAS.2009.5118253
Filename
5118253
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