• DocumentCode
    2262061
  • Title

    Shielding methodologies in the presence of power/ground noise

  • Author

    Köse, Selçuk ; Salman, Emre ; Friedman, Eby G.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Rochester, Rochester, NY, USA
  • fYear
    2009
  • fDate
    24-27 May 2009
  • Firstpage
    2277
  • Lastpage
    2280
  • Abstract
    Design guidelines for shielding in the presence of power/ground (P/G) noise are presented in this paper. The effect of noise in the P/G network is analyzed for various line lengths, line widths, and interconnect driver resistances. A 2pi RLC model is used to investigate the effect of both coupling capacitance and mutual inductance on the crosstalk noise. For a range of shield lengths and widths, a shield line can degrade signal integrity by increasing the crosstalk noise on the victim line. Different physical spacing and shield insertion methods are compared for various parameters in terms of the coupling noise on the victim line for a 65 nm technology node.
  • Keywords
    crosstalk; coupling capacitance; coupling noise; crosstalk noise; driver resistances; mutual inductance; power/ground noise; shield insertion method; shielding methodology; signal integrity; size 65 nm; Circuit noise; Coupling circuits; Crosstalk; Integrated circuit interconnections; Integrated circuit noise; Integrated circuit technology; Semiconductor device noise; Switches; Voltage; Working environment noise;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems, 2009. ISCAS 2009. IEEE International Symposium on
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-3827-3
  • Electronic_ISBN
    978-1-4244-3828-0
  • Type

    conf

  • DOI
    10.1109/ISCAS.2009.5118253
  • Filename
    5118253