• DocumentCode
    2262957
  • Title

    Two-stage large capacitive load amplifier with embedded capacitor-multiplier compensation

  • Author

    Yan, Zushu

  • Author_Institution
    Beijing Microelectron. Technol. Inst., Beijing, China
  • fYear
    2009
  • fDate
    24-27 May 2009
  • Firstpage
    2481
  • Lastpage
    2484
  • Abstract
    This paper proposes a low-voltage, low-power, two-stage operational transconductance amplifier (OTA) for driving large capacitive loads. The embedded capacitor-multiplier compensation mechanism facilitates using a very small Miller capacitor which generates widely separated left-half-plane (LHP) poles without introducing a right-half-plane (RHP) zero. Besides, it provides a feedforward signal path to create a LHP zero and therefore significantly improves the stability of the OTA. Furthermore, a simple but efficient Class AB output stage is used to achieve fast setting response and avoid extra static power dissipation. The proposed OTA was designed in a standard 0.35-mum CMOS technology. Detailed simulation results demonstrate that when driving 1000 pF capacitive load, the OTA has 77-dB gain, 1.41-MHz unit-gain frequency (UGF) and 0.6-V/mus average slew rate while dissipating only 45 muW under 1.5-V supply.
  • Keywords
    CMOS integrated circuits; capacitors; operational amplifiers; Class AB output stage; Miller capacitor; average slew rate; capacitance 1000 pF; embedded capacitor; feedforward signal path; frequency 1.41 MHz; gain 77 dB; left-half-plane pole; multiplier compensation mechanism; operational transconductance amplifier; power 45 muW; size 0.35 mum; static power dissipation; two-stage large capacitive load amplifier; unit-gain frequency; voltage 1.5 V; CMOS technology; Capacitors; Circuits; Frequency; Microelectronics; Operational amplifiers; Poles and zeros; Power dissipation; Transconductance; Transient response;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems, 2009. ISCAS 2009. IEEE International Symposium on
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-3827-3
  • Electronic_ISBN
    978-1-4244-3828-0
  • Type

    conf

  • DOI
    10.1109/ISCAS.2009.5118304
  • Filename
    5118304