DocumentCode :
2263207
Title :
Floorplanning and thermal impact on leakage power and proper operation of complex SOC designs
Author :
Abadir, Magdy S.
Author_Institution :
Freescale Semicond. Inc., Austin, TX
fYear :
0
fDate :
0-0 0
Abstract :
In this paper, we demonstrate the need for considering the floorplan when the leakage power is calculated for a SoC. We proposed a leakage power estimation methodology which considers the floorplan of the SoC and the cycle-by-cycle dynamic power behavior while estimating leakage power. This methodology has been experimented with on three industrial SoC designs and we observed up to a 44.1% difference in leakage power between various floorplans. We believe that our estimation methodology is generic and can be useful for a wide variety of SoCs
Keywords :
integrated circuit design; leakage currents; system-on-chip; SOC designs; dynamic power behavior; leakage power estimation; CMOS technology; Energy consumption; High performance computing; Leakage current; Low power electronics; Manufacturing processes; Power dissipation; System-on-a-chip; Temperature sensors; USA Councils;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
On-Line Testing Symposium, 2006. IOLTS 2006. 12th IEEE International
Conference_Location :
Lake Como
Print_ISBN :
0-7695-2620-9
Type :
conf
DOI :
10.1109/IOLTS.2006.39
Filename :
1655522
Link To Document :
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