• DocumentCode
    2264124
  • Title

    Reverse engineering for board test

  • Author

    Carlson, Kris ; Hauptmann, Bernd

  • Author_Institution
    Seica, Inc., Salem, NH, USA
  • fYear
    2009
  • fDate
    14-17 Sept. 2009
  • Firstpage
    224
  • Lastpage
    228
  • Abstract
    Historically, customers are faced with situations where CCA data is not available for a variety of reasons. Situations where Original Equipment Manufacturers (OEM) have been acquired by other OEMs or designs have been generated prior to the age of remote storage or escrow agents can result in the loss of data. Some companies, especially market segments such as depot repair, no longer have access to actual CAD or memory disks containing the original design files or source code of a particular CCA. With contract obligations up to 20 years what can a field repair shop or depot do to create documentation for a particular CCA? The answer lies in utilizing ATE Flying Probers particularly designed to `reverse engineer´ a CCA. This paper will go through the steps of how one premier OEM has added new features and techniques for creating a netlist, schematic, and ultimately a full ICT test program from nothing but a CCA. Using Seica´s easy to use Viva wizard software, along with a series of powerful software techniques not previously marketed, and an Aerial double sided, multiple head, flying prober can reverse engineer a board in very little time. Reverse Engineering can assist the depots in documentation creation and full test functionality.
  • Keywords
    automatic test software; circuit analysis computing; printed circuit testing; reverse engineering; OEM; Seica; Viva wizard software; automatic test equipment; electronic board test; flying probe test program; original equipment manufacturers; reverse engineering; Automatic testing; Bills of materials; Documentation; Electronic equipment testing; Gold; Impedance measurement; Manufacturing; Probes; Reverse engineering; Software testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    AUTOTESTCON, 2009 IEEE
  • Conference_Location
    Anaheim, CA
  • ISSN
    1088-7725
  • Print_ISBN
    978-1-4244-4980-4
  • Electronic_ISBN
    1088-7725
  • Type

    conf

  • DOI
    10.1109/AUTEST.2009.5314092
  • Filename
    5314092