Title :
Indirect investigation of heat transfer of electronic system
Author :
Frivaldsky, Michal ; Spanik, P. ; Drgona, P. ; Koscelnik, Juraj
Author_Institution :
Dept. of Mechatron. & Electron., Univ. of Zilina, Zilina, Slovakia
Abstract :
This paper deals with the development of methodology suited for design of computation algorithm which is able to determine power losses of electronic systems based on measured temperature distribution. Second part of paper is given to development of methodology for optimal selection of mentioned active components for thermal simulation model of given electronic system. Finally experimental verification of proposed methodology is presented.
Keywords :
electronics packaging; heat transfer; losses; temperature distribution; temperature measurement; thermal analysis; active components; computation algorithm design; electronic system; heat transfer; indirect investigation; methodology development; optimal selection; packaging process; power losses; temperature distribution measurement; thermal simulation model; Computational modeling; Heating; Integrated circuit modeling; Loss measurement; Mathematical model; Power dissipation; Temperature measurement; deterministic algorithm; optimization; thermal model;
Conference_Titel :
Applied Electronics (AE), 2014 International Conference on
Conference_Location :
Pilsen
Print_ISBN :
978-8-0261-0276-2
DOI :
10.1109/AE.2014.7011676
